TEC112730 semiconductor refrigeration chip — 62 x 62 mm Key benefits - Efficient heat transfer: Uses semiconductor refrigeration technology to move heat reliably and precisely, helping maintain target temperatures in compact systems. - Compact, consistent footprint: The 62 x 62 mm size provides a predictable mounting area that simplifies mechanical integration and system layout. - Reliable, low-maintenance operation: Solid-state refrigeration avoids moving parts, reducing wear and routine maintenance compared with mechanical coolers. - Versatile integration: Designed for straightforward incorporation into assemblies that require a discrete refrigeration element of this exact size. What it does and why it matters - Function: The TEC112730 provides localized cooling through semiconductor refrigeration, delivering controlled thermal management where traditional methods are impractical. - Problem solved: It enables precise cooling of sensitive components and small enclosures, preventing overheating, improving stability, and extending component life without adding bulky refrigeration hardware. - What makes it stand out: A standardized 62 x 62 mm form factor combined with semiconductor refrigeration technology gives designers a compact, repeatable solution for temperature control tasks. Important attributes - Model: TEC112730 - Type: Semiconductor refrigeration chip (solid-state) - Size: 62 x 62 mm footprint - Function: Localized, controllable cooling for integration into electronic and thermal systems - Performance characteristics: Efficient heat transfer and dependable refrigeration performance (operate with appropriate heat sinking and power/control circuitry) Integration and compatibility notes - Mounting: The 62 x 62 mm dimension provides a defined area for mounting and for pairing with heat sinks or cold plates sized to the chip. - System requirements: For best results, pair the TEC112730 with suitable heat dissipation hardware and power/control electronics appropriate to your application. - Safety and handling: Handle as a semiconductor device and follow standard ESD and mechanical mounting precautions. Typical applications - Electronics cooling: Localized cooling for power modules, sensors, laser diodes, or other heat-sensitive components where space is limited. - Laboratory and instrumentation: Temperature stabilization for small test chambers, sample holders, or analytical equipment requiring precise, compact cooling. - Portable or compact refrigeration assemblies: Integration into small cold boxes, beverage or sample coolers, and custom thermal management modules that need a defined 62 x 62 mm cooling element. Ordering and specification reminder - Confirm the TEC112730 model and 62 x 62 mm size meet your mechanical and thermal integration requirements before finalizing system design. - Ensure appropriate heat sinking, power supply, and control mechanisms are specified to achieve required cooling performance.