Features 1、High Performance: Has strong continuous printing performance, suitable for fine pitch IC and BGA and relatively accuracy components welding 2、Easy to Use: This low temperature solder paste has good wetting and mold release, and is resistant to cold slump, hot slump and drying 3、Application: Suitable for PCB welding of various high demand materials, and rarely phenomenons of tin tombstone displacement 4、Less Residue: Full and bright tin beads on tin, less residue, white and transparent, no fluorine and other extremely corrosive substances 5、Basic Specifications: The particles are 25‑45um (No. 3 powder), the ingredients are Sn42, Bi58, used for mobile phone CPU IC, etc. Specification Item Type: Low Temperature Flux Paste Model: SFD-231 Composition: Sn42 Bi58 Granules: 25-45um (No.3 powder) Weight: 45g/Pcs with Tube Applicable: Mobile phone CPU IC, etc. Melting Point: 138℃ Material: Tin Package List 1 x Low Temperature Flux Paste